Modifying the reed switch leads is a very complicated process and special tools should be used to not transmit shocks to the contacts or transfer sensitivity. We have to modify the different forms of reed switch construction listed below within the specified tolerances to suit different applications:
Cutting Reed Switch
Clamp the leads outside the sealing glass to prevent shocks from transferring to the contacts. Cut unnecessary leads quickly. Tailored reed switches can be used to solder longer package lengths than custom cases.
SMD dry reed pipe
Clamp the outer glass-encased leads, cut to the desired length, and then form the patch. Reed switches that produce uneven leads (which require extra pressure and may damage the contacts) require that the leads be leveled. As a result, the reed switch formed by the patch has a sensitivity in the largest group facing the inner blades. Using SMD reed sensors to avoid shock and vibration in applications is a cost effective solution.
Goal reed switch
Clamp the wire outside the glass seal to prevent the impact from transferring to the contact point, cut to the desired length, and then form the shape of the goal post. The blades always face the vertical group with the highest set of sharpness of the molded lead. The PCB-mounted reed sensor is a cost-effective solution for applications with stable ambient conditions.
L type reed switch
Clamp the wires outside the glass seal to prevent shocks from transferring to the contact points and cut to the required length to form an L-shape that can be used to make welded and brazed assemblies.
Welding Reed Switch
The conductors outside the glass seal are clamped to prevent contact with the contacts and cut to the required length to form an L-shaped reed switch. The assembly formed by L is soldered to a non-magnetic wire, which eventually leads to electroplating solderability. These types of reeds are mounted vertically on the PCB.
The cut-out reed switch is thin welded for simplification and tin plating. These components can be packaged in a plastic enclosure. A thin layer of flexible and resilient compound is a cost effective alternative to proximity sensors in cylindrical housings.