Normally Close Magnetic Reed SMD Switch
As we all know that the SMD magnetic reed is in high demand for many industrial applications. Black color plastic and resin encapsulation, short feet or long feet style, strong physical parameter, the SMD magnetic reed becomes more frequently used in all kinds of production, installtion, and...
As we all know that the SMD magnetic reed is in high demand for many industrial applications. Black color plastic and resin encapsulation, short feet or long feet style, strong physical parameter, the SMD magnetic reed becomes more frequently used in all kinds of production, installtion, and system.
This page is to talk about the bestseller model Normally close magnetic reed SMD switch. NC way is normally close deisgn. When the cycle is on, the circuits are always close. The action will not be activated until magnetic environment changes. This theory can lead to many different usage.
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Just pay attention to the theme of the various professional conferences that are held around the country today. It is not difficult to know which of the latest technologies are used in electronic products. CSP, 0201 passive components, lead-free soldering, and optoelectronics are arguably the most advanced technologies that many companies have demonstrated in PCB manufacturing and SMT processing. For example, how to handle the ultra-small hole (250um) problem that is common in CSP and 0201 assembly is the fundamental physical problem that solder paste printing has never had. Board-level optoelectronics assembly, as a major area of communication and networking skills, is very sophisticated. The typical package is expensive and easily damaged, especially after the device leads are formed. The descriptive guidance for these cluttered skills is also very different from the usual SMT process because plate depiction plays a more important role in ensuring assembly productivity and product reliability; for example, for CSP solder interconnects, By changing the scale of the board bonding disk, there can be a marked improvement in reliability.
One of the key skills common to everyone today is CSP. The charm of CSP skills lies in its many advantages, such as reducing the size of the package, adding needles, function enhancements, and reworkability of the package. CSP's high-efficiency advantages Nowadays, when used in board assembly, it is possible to extend the boundary of a small package (down to 0.075mm) around the package and enter a large-range (1, 0.8, 0.75, 0.5, 0.4mm) area array layout.
Many CSP devices have been used in the consumer telecoms category for many years and are widely considered to be low-cost solutions in the areas of SRAM and DRAM, medium pin ASICs, flash memory and micro-processors. CSP can have four fundamental features: rigid bases, flexible bases, lead-based structures, and wafer-level planning. CSP skills can replace SOIC and QFP equipment and become mainstream component skills.
One problem with the CSP assembly process is that the bond pads of the solder interconnects are small. The typical 0.5 mm distance CSP bond pad scale is 0.250 to 0.275 mm. On such a small scale, it is very difficult to print solder paste through openings with an area ratio of 0.6 or lower. However, choosing a well-crafted process can successfully print. The onset of the problem is usually due to the lack of solder caused by the blocking of the opening of the template. Board-level reliability depends primarily on the type of package, while CSP devices can average from -400 to 125°C heat cycles from 800 to 1200 times without the need for underfilling. However, if you choose to use underfill data, most CSPs will add 300% of their heat-safety features. CSP equipment problems are usually related to fatigue cracking of solder.
Advancement of passive components
Another major new category is 0201 passive component technology. Because of the reduced market size of the board scale, we attach great importance to 0201 components. Since the launch of 0201 components in mid-1999, cell phone makers have assembled them with CSPs into phones, which has reduced the plate size by at least half. Disposing of these types of packages is a very costly process. To reduce the appearance of defects (such as bridging and erection) after the process, the optimization of the pad scale and the distance between components are critical. Just to describe it reasonably, these packages can be placed close together, with distances as small as 150mm.
In addition, 0201 equipment can be placed under the BGA and larger CSP. Cross section of 0201 below 14mm CSP assembly with 0.8mm distance. Because the scale of these small discrete components is very small, the assembly equipment manufacturers have developed and updated the system compatible with 0201.
By 2009, the actual mass production of mobile phones has adopted 01005 (imperial, metric 0402) process. By 2013, 03015 (Metric) and below parts have entered the stage of placement experiments.
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